Application：Micro nano processing, semiconductor process research and development, and process optimization.

Sales target：Colleges, research laboratories, and enterprise research and development departments.

Technology field and industry：The production of optical communication, 5G, optoelectronic integration, compounds, and silicon-based semiconductor devices.

Involving technology：Lithography, nanoimprinting, heated imprinting, electron beam direct writing, laser direct writing

application：Industry, academia, and research on photoresist and its raw materials.

Sales target：Universities, semiconductor/information technology and electronic chemical/new material research laboratories, and R&D departments of photoresist and its raw material enterprises; Resin manufacturers, composite compounds, and photosensitive material manufacturers.

Technology field and industry： LTJ has been serving the Japanese photoresist industry for decades, using the Mack model created by American photoresist expert Chris Mack to analyze the characteristics of photoresist. The parameters collected using LTJ equipment are not only crucial for the development of photoresist properties, but also for the subsequent simulation and simulation involving technologies such as optics, physics, and chemistry.

application：Save costs on lithography process design and optimization.

Target Users：Technical research institutes, universities, equipment manufacturers, they are lithography process researchers, designers, etc.

Technology field and industry：Photolithography up to 45nm nodes, E-Beam direct writing, laser direct writing, FPD, photomask, semiconductor, NIL, 5G, manufacturer of nanoscale devices.

Technologies involved：Scanning and stepper exposure, electron beam exposure, laser exposure.

application：Focusing on improving the uniformity, reliability, accuracy, and user friendliness of the use of scanning electron microscopy (SEM).

Target Users：Nanodevice manufacturer, scanning electron microscope operator, nanodevice research institute.

Technology field and industry：E-Beam direct writing, laser direct writing.

Technologies involved：Edge roughness, line width roughness, automatic edge search, multi shape feature measurement, cross-sectional measurement, contour search, batch measurement, one click similarity search.